Shenzhen Senyan Circuit Co., Ltd.
Shenzhen Senyan Circuit Co., Ltd.
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1.Detailed Specification of PCB Board Manufacturing
| 1 | Layer | 1-30 layer |
| 2 | Material | FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum |
| 3 | Board thickness | 0.4mm-4mm |
| 4 | Max.finished board side | 500mm*500mm |
| 5 | Min.drilled hole size | 0.25mm |
| 6 | Min.line width | 0.10mm(4mil) |
| 7 | Min.line spaceing | 0.10mm(4mil) |
| 8 | Surface finish/treatment | HASL/HASL lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
| 9 | Copper thickness | 1/2OZ 1OZ 2OZ 3OZ |
| 10 | Solder mask color | green/black/white/red/blue/yellow |
| 11 | Inner packing | Vacuum packing,Plastic bag |
| 12 | Outer packing | Standard carton packing |
| 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
| 14 | Certificate | ISO9001,ISO14001,ROHS,CQC |
| 15 | Profiling Punching | Routing,V-CUT,Beveling |
| 16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
2.Detailed Terms for PCB Assembly
| Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology |
| Various sizes like 1206,0805,0603 components SMT technology | |
| ICT(In Circuit Test),FCT(Functional Circuit Test) technology | |
| PCB Assembly With CE,FCC,Rohs Approval | |
| Nitrogen gas reflow soldering technology for SMT | |
| High Standard SMT&Solder Assembly Line | |
| High density interconnected board placement technology capacity | |
| Quote&Production Requirement | Gerber File or PCB File for Bare PCB Board Fabrication |
| Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly | |
| To reduce the quote time, please provide us the full part number for each components,Quantity per board also the quantity for orders. | |
| Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate | |
| OEM/ODM/EMS Services | PCBA, PCB assembly: SMT & PTH & BGA |
| PCBA and enclosure design | |
| Components sourcing and purchasing | |
| Quick prototyping | |
| Plastic injection molding | |
| Metal sheet stamping | |
| Final assembly | |
| Test: AOI, In-Circuit Test (ICT), Functional Test (FCT) | |
| Custom clearance for material importing and product exporting | |
| Other PCB Assembly Equipments | SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4 |
| Reflow Oven: FolunGwin FL-RX860 | |
| Wave Soldering Machine: FolunGwin ADS300 | |
| Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service | |
| Fully Automatic SMT Stencil Printer: FolunGwin Win-5 |
